What is “Cu-ETP” Material?
Cu-ETP, short for Copper Electrolytic Tough Pitch, is a type of copper that is widely used in the electrical industry due to its high electrical conductivity and resistance to corrosion. This type of copper is commonly found in electrical wiring, power generation equipment, and other electrical applications.
One of the key advantages of Cu-ETP is its high conductivity. It has a conductivity rating of 100% IACS, making it one of the most conductive metals available. This makes it an ideal choice for applications that require the efficient transfer of electrical energy, such as power generation and transmission.
Cu-ETP is also highly resistant to corrosion, making it a durable and long-lasting choice for electrical applications. This is particularly important in coastal and industrial environments where copper is exposed to harsh conditions that can cause corrosion and damage over time.
In addition to its high conductivity and resistance to corrosion, Cu-ETP is also a versatile material that can be easily shaped and formed into a variety of different forms. This makes it well-suited for a wide range of electrical applications, including power generation, transmission, and distribution.
In conclusion, Cu-ETP is an excellent choice for electrical applications that require high conductivity and resistance to corrosion. Its versatility and long-lasting durability make it a popular choice among manufacturers and engineers in the electrical industry.
Application Areas & Industries of “Cu-ETP”
Copper Electrolytic Tough Pitch (CuETP), also known as C110 copper, is a highly conductive and corrosion-resistant copper alloy that is commonly used in electrical and electronic applications. Some of the key application areas and industries that make use of CuETP include:
- Electrical wiring and cables: CuETP is an ideal choice for electrical wiring and cables due to its high conductivity and resistance to corrosion.
- Electrical connectors: CuETP is also used in the manufacture of electrical connectors, such as plugs, sockets, and terminals, due to its high conductivity and good mechanical strength.
- Printed circuit boards: CuETP is commonly used as the base material for printed circuit boards (PCBs) due to its high conductivity, corrosion resistance, and good machinability.
- Electronic components: CuETP is also used in the manufacture of various electronic components such as resistors, capacitors, and transistors.
- Industrial machinery: CuETP is widely used in the manufacture of industrial machinery, such as heat exchangers, power generation equipment, and busbars, due to its high conductivity and good mechanical strength.
- Building construction: CuETP is used in building construction as roofing, flashing, and guttering due to its weather resistance and attractive appearance.
- Automotive and transportation: CuETP is used in automotive wiring, brake components, and transportation infrastructure due to its high conductivity and excellent corrosion resistance.
Please note that these are just a few examples of the many application areas and industries for Cu-ETP. The specific uses for Cu-ETP may vary depending on the specific alloy composition and manufacturing process. It’s important to consult the manufacturer or supplier for the specific properties of the Cu-ETP being used in an application.
Common Fabrication Processes of “Cu-ETP”
Cu-ETP, also known as Copper Electrolytic Tough Pitch, is a commonly used material in the electrical industry due to its high electrical conductivity and resistance to corrosion. To produce various electrical components and parts, several fabrication processes are used to shape and form Cu-ETP into the desired shape and size. Some of the most common fabrication processes for Cu-ETP include:
Casting: This process involves pouring molten Cu-ETP into a mold to produce a specific shape. This is a common method for producing large, complex parts such as electrical generators and motors.
Extrusion: In this process, Cu-ETP is forced through a die to produce a shape with a constant cross-section. Extrusion is commonly used to produce parts such as electrical wires and rods.
Rolling: The rolling process involves passing a sheet of Cu-ETP between rollers to reduce its thickness and increase its length. This process is used to produce sheets and strips for electrical applications.
Forging: In this process, Cu-ETP is shaped by hammering or pressing it into a specific shape. This is a common method for producing electrical connectors and other small parts.
Stamping: In this process, Cu-ETP is cut, bent, or stamped into a specific shape using a die. This is a common method for producing electrical contactors and other small parts.
Overall, these fabrication processes allow manufacturers to produce a wide variety of Cu-ETP parts and components for different electrical applications. The choice of the fabrication process will depend on the desired final shape, size, and the quantity of the parts that need to be produced.
Chemical Composition of “Cu-ETP”
Cu-ETP, also known as Copper Electrolytic Tough Pitch, is a type of copper that is widely used in the electrical industry due to its high electrical conductivity and resistance to corrosion. The chemical composition of Cu-ETP is typically made up of 99.90% copper, with trace amounts of other elements such as oxygen, sulfur, and phosphorus.
The high copper content in Cu-ETP gives it its high electrical conductivity, making it an ideal choice for electrical applications that require efficient transfer of electrical energy. The trace amounts of oxygen, sulfur, and phosphorus are added to the copper to improve its mechanical properties and resistance to corrosion.
The oxygen and sulfur in Cu-ETP work together to form a thin, protective oxide layer on the surface of the copper that helps to prevent corrosion. The phosphorus, on the other hand, improves the strength and hardness of the copper, making it more durable and resistant to wear and tear.
It’s worth to mention that the composition of Cu-ETP can vary slightly depending on the manufacturer and the intended application. Some manufacturers may use slightly different percentages of other elements to achieve specific properties or performance characteristics.
In conclusion, Cu-ETP is a type of copper that has high electrical conductivity and resistance to corrosion due to its chemical composition, which is typically 99.90% copper, with trace amounts of oxygen, sulfur, and phosphorus. These elements are added to improve the mechanical properties and resistance to corrosion.
| Element | Percentage by Weight |
|---|---|
| Copper | 99.9% |
| Oxygen | 0.01% – 0.04% |
| Iron | 0.005% – 0.03% |
| Sulfur | 0.005% – 0.03% |
Physical Properties of “Cu-ETP”
The physical properties of Cu-ETP (Copper Electrolytic Tough Pitch) include:
Density: 8.9 g/cm³
Melting Point: 1083 °C
Malleability: Good
Ductility: Good
Thermal Conductivity: 401 W/m.K
Hardness: Annealed (HV20) 75-95
Tensile Strength: 260-510 MPa
Elongation: 10-30%
Modulus of Elasticity: 110 GPa
Please note that the values of these properties can vary slightly depending on the specific manufacturing process and the intended application.
Fabrication Properties of “Cu-ETP”
The fabrication properties of Cu-ETP (Copper Electrolytic Tough Pitch) include:
Weldability: Good
Solderability: Good
Brazability: Good
Machinability: Fair
Formability: Good
Ductility: Good
Hardness: Annealed (HV20) 75-95
Tensile Strength: 260-510 MPa
Elongation: 10-30%
Modulus of Elasticity: 110 GPa
These fabrication properties are related to the ability of Cu-ETP to be shaped and formed into different forms.
Weldability: it refers to the ability of copper to be welded using different welding techniques. Cu-ETP has good weldability, which makes it easy to join different pieces of copper together.
Solderability: it refers to the ability of copper to be soldered, which involves bonding copper to other metals using a low-melting-point alloy. Cu-ETP has good solderability
Brazability: it refers to the ability of copper to be brazed, which involves bonding copper to other metals using a filler metal that has a higher melting point than soldering alloy. Cu-ETP has good brazability
Machinability: it refers to how easy or difficult it is to machine the material. Cu-ETP has fair machinability, which means that it can be machined with some difficulty
Formability: it refers to the ability of copper to be shaped and formed into different forms. Cu-ETP has good formability, which makes it easy to shape and form.
Please note that the values of these properties can vary slightly depending on the specific manufacturing process and the intended application.
Applicable Specifications of “Cu-ETP”
Cu-ETP (Copper Electrolytic Tough Pitch) is a type of copper that is commonly used in the electrical industry due to its high electrical conductivity and resistance to corrosion.
The following are some of the commonly used specifications for Cu-ETP:
ASTM B187/B187M- Standard Specification for Copper Bus Bar, Rod, and Shapes and General Purpose Rod, Bar, and Shapes
ASTM B188- Standard Specification for Seamless Copper Bus Pipe and Tube
ASTM B283/B283M- Standard Specification for Copper and Copper Alloy Die Forgings (Hot Pressed)
ASTM B451 – Standard Specification for Copper Foil, Strip, and Sheet for Printed Circuits and Carrier Tapes
ASTM B506 – Standard Specification for Copper Clad Stainless Steel Sheet and Strip for Building Construction
ASTM B694 – Standard Specification for Copper, Copper Alloy, and Copper-Clad Stainless Steel Sheet and Strip for Electrical Cable Shielding
SAE J461 – Wrought and Cast Copper Alloys
SAE J463 – Wrought Copper and Copper Alloys
ASME SB124 – Copper and Copper Alloy Forging Rod, Bar and Shapes
ASME SB152 – Copper Sheet, Strip, Plate and Rolled Bar
ASME SB187 – Copper Bus Bar, Rod and Shapes and General Purpose Rod, Bar and Shapes
AMS 4500- Copper Sheet, Strip and Plate, Soft Annealed
Please note that the above is not an exhaustive list, and other specifications may also be applicable to Cu-ETP, depending on the intended application and the specific requirements of the manufacturer or end-user. Also, the standard maybe change over time so it’s important to check the latest version of the standard.
Thermal Properties of “Cu-ETP”
The thermal properties of Cu-ETP (Copper Electrolytic Tough Pitch) include:
Thermal conductivity: Cu-ETP has a high thermal conductivity of around 401 W/m·K (at 20°C), which is about 60% higher than that of common steel and about 20% higher than that of pure copper. This means that it is able to transfer heat efficiently, making it useful in applications where heat dissipation is important.
Thermal expansion: Cu-ETP has a relatively low coefficient of thermal expansion of around 16.5 µm/m·K (at 20-100°C). This means that it experiences minimal expansion and contraction when exposed to changes in temperature, making it useful in applications where dimensional stability is important.
Melting point: The melting point of Cu-ETP is around 1083 °C (1981 °F)
Specific heat: The specific heat of Cu-ETP is around 0.39 J/g·°C (0.093 Btu/lb·°F)
Please note that these are typical values for Cu-ETP and the exact thermal properties may vary depending on the specific alloy composition and manufacturing process. It’s important to consult the manufacturer or supplier for the specific thermal properties of the Cu-ETP being used in an application.
Typical Uses of “Cu-ETP”
The typical uses of Cu-ETP (Copper Electrolytic Tough Pitch) can be broadly categorized into four main sections:
The typical uses of Cu-ETP (Copper Electrolytic Tough Pitch) can be broadly categorized into four main sections:
- Product Category: Electrical and electronic applications
Product: Electrical wiring and cables, electrical connectors, printed circuit boards, electronic components, and electronic equipment
Reason Category: Conductivity and corrosion resistance
Reason: Cu-ETP has a high conductivity and excellent corrosion resistance, making it ideal for electrical and electronic applications where these properties are important. - Product Category: Industrial applications
Product: Busbars, heat exchangers, power generation equipment, and industrial machinery
Reason Category: Conductivity and strength
Reason: Cu-ETP has a high conductivity and good mechanical strength, making it well suited for use in industrial applications where these properties are important. - Product Category: Building construction
Product: Roofing and flashing, guttering, and architectural elements
Reason Category: Weather resistance and aesthetics
Reason: Cu-ETP is highly resistant to weathering and has a natural, attractive appearance, making it a popular choice for use in building construction. - Product Category: Automotive and transportation
Product: Automotive wiring, brake components, and transportation infrastructure
Reason Category: Conductivity and corrosion resistance
Reason: Cu-ETP has a high conductivity and excellent corrosion resistance, making it ideal for use in automotive and transportation applications where these properties are important.
It’s worth noting that these are just some of the common uses of Cu-ETP, and the material can be used in other applications as well. It’s important to consult with the supplier or the manufacturer to ensure that the Cu-ETP meets your specific requirements for a certain application.
Equivalents of “Cu-ETP”
Cu-ETP (Copper Electrolytic Tough Pitch) is a commonly used copper alloy known for its high conductivity and corrosion resistance. Other materials that can be used as a substitute for Cu-ETP include:
C10100, C10200, C10300, C10800, C12000: These are all high conductivity copper alloys with varying levels of purity and properties.
Cu-OF (Oxygen-free Copper): Cu-OF is a high-purity copper with a minimum of 99.99% copper content that has similar conductivity and corrosion resistance to Cu-ETP.
Silver: Silver is a more expensive option but has a higher conductivity than Cu-ETP.
Aluminum: Aluminum is a lower-density, lower-cost alternative to Cu-ETP that can be used in some electrical applications.
Gold: Gold is another more expensive option but has a higher conductivity than Cu-ETP.
It’s important to note that the final selection of a substitute material will depend on the specific application and the properties that are required.
